Herb is probably tied up with the interposer workshop at GIT, so I'll jump in - Simon's point was that the world is going to 3D IC, which means using vertical interconnects/Through Silicon Vias to connect stacked chips. Using TSVs decreases line lengths significantly, and this is where the decrease in resistance and capacitance occurs.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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