@anon5203197, Thanks. Will try this weekend. We approached Sony but looks like they just replace it with new one and dont repair the existing one, here in India. And for doing that they were asking for original bills, who will keep bills for 3 to 4 years :-)...and that too we bought international so they were very resistant about doing anything.
The photo of the processor shows a metal window frame around the die. This could be a stiffener, used to stiffen the organic substrate ( green ) on which the die is assembled. Such substrates are called Coreless substrates, w/o the usual PCB like Core that gives the Substrate its strength & rigidity but adds inductance to the power delivery and signal path thus slowing things down electrically. Coreless substrates are troublesome & expensive so used thus far only for high performance Servers etc. If this is indeed a Coreless substrate then would be the first use in a Game system.
Is the new PS 4 much faster than the last model ?
Would ChipWorks be interested in verifying if Sony is indeed using a Coreless substrate and Stiffener ? They just need to look at their x - sections & x - rays once again.
My Sony PS3 doesnt come up it says some drive issue, tried going to Sony's showroom and they say since you bought it from outside India we cant do anything. Also the hard drive is not available, we could have replace it ourselves.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.