One thing I forgot to mention is that the next-generation Xeon Phi will be implemented in Intel's 14-nanometer process technology--which should shrink the die even though the whole package may stay the same size or even grow depending on how many memory die are added is alongside the processor.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.