Breaking News
Comments
Oldest First | Newest First | Threaded View
Page 1 / 2   >   >>
R_Colin_Johnson
User Rank
Author
Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 10:40:07 AM
NO RATINGS
One thing I forgot to mention is that the next-generation Xeon Phi will be implemented in Intel's 14-nanometer process technology--which should shrink the die even though the whole package may stay the same size or even grow depending on how many memory die are added is alongside the processor.

rick merritt
User Rank
Author
Re: Knights Landing in 14nm
rick merritt   11/20/2013 11:12:58 AM
NO RATINGS
It will be interesting to see if Intel uses the 2.5-D approach Xilinx pioneered or...

R_Colin_Johnson
User Rank
Author
Re: Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 11:15:41 AM
NO RATINGS
I asked them specifically if they would use a 2.5-D silicon interposer, but all they would say is that it will be "high bandwidth".

krisi
User Rank
Author
Re: Knights Landing in 14nm
krisi   11/20/2013 11:38:20 AM
NO RATINGS
Colin, something is not adding up for me...in teh title you say "customize", that menas to me many different versions for different applications, customers, etc...but then you add "highest integration" which implies one die that can do many things...kind of contrary to "customization"...I must be missing something here...Kris

R_Colin_Johnson
User Rank
Author
Re: Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 11:41:51 AM
NO RATINGS
Intel claims to be doing both--integration of more functions, but offering customizable versions to key customers.

LarryM99
User Rank
Author
Re: Knights Landing in 14nm
LarryM99   11/20/2013 5:51:19 PM
NO RATINGS
I have to wonder who those key customers might be and how much of the market they would involve. I know that hard-core PC gamers like to overclock their systems, but this would potentially go well beyond that. Is the Intel architecture really modular enough to support a chinese menu approach to CPU design? What kind of volume would be required to qualify as a "key" customer? And finally, what are the implications for the software tool chain to the modifications?

R_Colin_Johnson
User Rank
Author
Re: Knights Landing in 14nm
R_Colin_Johnson   11/20/2013 6:14:10 PM
NO RATINGS
@LarryM99

Good questions all, but I don't think many answers will be available until next year when we get some examples. To hazard a guess, I'd say Google, Amazon and the like are buying Xeons in suffiencent quantity to be a "key" customer. Also some supercomputers use a lot of cores all by themselves, such as Milky Way which just won the Top500 with over three million cores.

Sheetal.Pandey
User Rank
Author
Re: Knights Landing in 14nm
Sheetal.Pandey   11/21/2013 12:55:03 PM
NO RATINGS
Customizing high end processors is a good move from Intel. With increasing demands from datacenters like facebook, twitter and other sites the need for custmization has increased.

R_Colin_Johnson
User Rank
Author
Re: Knights Landing in 14nm
R_Colin_Johnson   11/21/2013 2:30:53 PM
NO RATINGS
Yes, its a matter of do it, or somebody else will!

prax_#1
User Rank
Author
impact on ARM
prax_#1   11/22/2013 7:21:06 AM
NO RATINGS
Colin, any insights on how this change in business model shall impact ARM's server dreams as ARM claims one advantage that OEMs get by adopting ARM servers is that servers can be customized as per the requirements?  

Page 1 / 2   >   >>


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
The quality and reliability of Mill-Max's two-piece ...
01:34
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...