Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
resistion
User Rank
CEO
Quadruple patterning cheap enough?
resistion   12/7/2013 9:15:19 AM
NO RATINGS
16 nm needs quadruple patterning or 2x double patterning but chips per area not doubled. So patterning cost not doubled? Otherwise stay at 20 nm.

etienneazerty
User Rank
Rookie
Re: 3D NAND Challenges
etienneazerty   12/4/2013 7:57:54 AM
NO RATINGS
Frankly, all the references you gave are based on a etch process that is flawn. Very high aspect ratio etch has no relation with conventional etching, notion like taper angle are inexistent.

With the same number DRAM capacitance scaling is impossible since many generations. Samsung is leader in DRAM by the way, so such etching technology is all but new.

I really think that we need a guy to catch a VNAND die, cut it and show to the community what is really inside so "consultants" can start from real numbers.

FraAmelia
User Rank
Rookie
SS 3D: 24 layers
FraAmelia   12/4/2013 4:23:43 AM
NO RATINGS
Based on what SS discolsed the 128Gb V-NAND has 24 layers not 32. could you please comment?

thanks

toom_tabard
User Rank
Manager
3D NAND Challenges
toom_tabard   12/3/2013 2:06:34 PM
Great article Gary.

The cost aspects of Samsung/Toshiba's vertical channel 3D NAND approaches were published last month in the IEEE Transactions on Semiconductor Manufacturing (see the following link for free download: http://bit.ly/1imVpBb)

A description of these cost challenges along with other technical issues can be found here at 3DIncites: http://bit.ly/17c1DPw

The main points are:

(1) If those vertical holes and slits are beyond a few tenths of a degree from the normal (in other words, if they are slightly slanted), the whole concept is no longer economically viable and can be undercut in cost by other approaches.

(2) The string currents rapidly decline as densities/capacities increase to the point where the question arises whether such approaches are indeed foundations for several generations to come or are simply one-offs.

Full disclosure - Both the IEEE paper and the 3DIncites piece were written by me.



Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Book Review: Deadly Odds by Allen Wyler
Max Maxfield
10 comments
Generally speaking, when it comes to settling down with a good book, I tend to gravitate towards science fiction and science fantasy. Having said this, I do spend a lot of time reading ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
13 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).