Breaking News
Comments
toom_tabard
User Rank
Manager
3D NAND Challenges
toom_tabard   12/3/2013 2:06:34 PM
Great article Gary.

The cost aspects of Samsung/Toshiba's vertical channel 3D NAND approaches were published last month in the IEEE Transactions on Semiconductor Manufacturing (see the following link for free download: http://bit.ly/1imVpBb)

A description of these cost challenges along with other technical issues can be found here at 3DIncites: http://bit.ly/17c1DPw

The main points are:

(1) If those vertical holes and slits are beyond a few tenths of a degree from the normal (in other words, if they are slightly slanted), the whole concept is no longer economically viable and can be undercut in cost by other approaches.

(2) The string currents rapidly decline as densities/capacities increase to the point where the question arises whether such approaches are indeed foundations for several generations to come or are simply one-offs.

Full disclosure - Both the IEEE paper and the 3DIncites piece were written by me.

etienneazerty
User Rank
Rookie
Re: 3D NAND Challenges
etienneazerty   12/4/2013 7:57:54 AM
NO RATINGS
Frankly, all the references you gave are based on a etch process that is flawn. Very high aspect ratio etch has no relation with conventional etching, notion like taper angle are inexistent.

With the same number DRAM capacitance scaling is impossible since many generations. Samsung is leader in DRAM by the way, so such etching technology is all but new.

I really think that we need a guy to catch a VNAND die, cut it and show to the community what is really inside so "consultants" can start from real numbers.

FraAmelia
User Rank
Rookie
SS 3D: 24 layers
FraAmelia   12/4/2013 4:23:43 AM
NO RATINGS
Based on what SS discolsed the 128Gb V-NAND has 24 layers not 32. could you please comment?

thanks

resistion
User Rank
Manager
Quadruple patterning cheap enough?
resistion   12/7/2013 9:15:19 AM
NO RATINGS
16 nm needs quadruple patterning or 2x double patterning but chips per area not doubled. So patterning cost not doubled? Otherwise stay at 20 nm.



Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

MSGEQ7-Based DIY Audio Spectrum Analyzer: Testing
Max Maxfield
13 comments
In my previous column on this topic, we discussed the step-by-step construction of the first pass at a MSGEQ7-based DIY audio spectrum analyzer for use in my BADASS Display project. Of ...

Karen Field

June 2014 Cartoon Caption Winner
Karen Field
13 comments
Congratulations to "Wnderer" for submitting the winning caption for our June cartoon, after much heated conversation by our judges, given the plethora of great entries.

Jeremy Cook

Inspection Rejection: Why More Is Less in a Vision System
Jeremy Cook
3 comments
Albert Einstein has been quoted as saying, "Everything should be as simple as possible, but not simpler." I would never claim to have his level of insight -- or such an awesome head of ...

Jeremy Cook

Machine Fixes That Made Me Go 'DUH!'
Jeremy Cook
21 comments
As you can see in my bio at the end of this article, I work as a manufacturing engineer. One of my favorite things that happens on a Friday late in the afternoon is to hear my phone ring ...

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)