Monolithic 3D does provide cost reduction ! Please note that not all 3D are alike. TSV base 3D does not provide cost reduction, but monolithic 3D does, you could get more details why and how in: <http://www.monolithic3d.com/3d-ic-edge1.html>. Clearly the number one advantage of all 3D NAND which are now reaching mass production is cost reduction !, similarly CEA Letri announcment of their agreement with Qualcomm for the development of monolithic 3D states that 3D provide the benifits of dimension scaling.
We have heard these grand pronouncements from this individual before. The last I remember was on HKMG gate last ( Intel, the incumbent ) or first ( consortia of Foundries led by Big Blue ). After inevitable problems surfaced with gate first, Samsung & TSMC got burnt and had to go back to gate last and was delayed by a couple of quarters. Credibiiity gap galore.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.