Embedded Systems Conference
Breaking News
Newest First | Oldest First | Threaded View
User Rank
Re: tremendous 3D integration
Or_Bach   12/30/2013 11:17:49 AM
Monolithic 3D does provide cost reduction ! Please note that not all 3D are alike. TSV base 3D does not provide cost reduction, but monolithic 3D does, you could get more details why and how in: <http://www.monolithic3d.com/3d-ic-edge1.html>. Clearly the number one advantage of all 3D NAND which are now reaching mass production is cost reduction !, similarly CEA Letri announcment of their agreement with Qualcomm for the development of monolithic 3D states that 3D provide the benifits of dimension scaling.   

User Rank
Re: tremendous 3D integration
wilber_xbox   12/30/2013 10:27:03 AM
3D integration will not lead to traditional cost-effective method of chip density. Rather it will add to more cost so the benefits will be limited to the technology only.

User Rank
Re: tremendous 3D integration
chipmonk0   12/19/2013 11:22:37 AM
We have heard these grand pronouncements from this individual before. The last I remember was on HKMG gate last ( Intel, the incumbent ) or first ( consortia of Foundries led by Big Blue ). After inevitable problems surfaced with gate first, Samsung & TSMC got burnt and had to go back to gate last and was delayed by a couple of quarters. Credibiiity gap galore.

User Rank
tremendous 3D integration
Or_Bach   12/18/2013 1:00:58 AM
Yes, the future is 3D integration, and now that it is practical monolithic 3D IC provide by far the best 3D integration. And quoating Meyerson: 

"It'll look like a single chip, but it will be about 50 chips stacked one on top of the other."

The additional advantage monolithic 3D provides is the ability to process many of those layer in one step, just like they do in 3D NAND, providing tremendous cost benifits.

Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

My Mom the Radio Star
Max Maxfield
Post a comment
I've said it before and I'll say it again -- it's a funny old world when you come to think about it. Last Friday lunchtime, for example, I received an email from Tim Levell, the editor for ...

Bernard Cole

A Book For All Reasons
Bernard Cole
Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...

Martin Rowe

Leonard Nimoy, We'll Miss you
Martin Rowe
Like many of you, I was saddened to hear the news of Leonard Nimoy's death. His Star Trek character Mr. Spock was an inspiration to many of us who entered technical fields.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Flash Poll