Embedded Systems Conference
Breaking News
Comments
Oldest First | Newest First | Threaded View
zewde yeraswork
User Rank
Author
balance
zewde yeraswork   1/27/2014 11:43:31 AM
NO RATINGS
It may be necessary to strike a balance between high costs on the one hand and other limitations on the other hand.

chipmonk0
User Rank
Author
Progress in 3-d chip stacking has been held back by..
chipmonk0   1/27/2014 11:56:51 AM
too many Govt. funded European Labs getting involved and putting out misleading white noise branded as scientific research. They are neither result oriented nor sufficiently grounded in Physics or comprehensive methodologies to develop whole new technologies for commercial application. Rather than comprehend the total challenge they indulge only in piecewise optimization - the result : endless "Technical" Conferences that evade the core technical challenges but keep harping on cost & supply chain issues instead!

Only belatedly have these European "Researchers" recognized the folly of the process flow ( derived from "Powerpoint Engr." w/o the benefit of Physics, data or even Engr. common sense ! ) they have been blindly following and so now this article talks about the issues related to temporary bonding / debonding steps in 3-d stacking of wafers / dice !

The whole wafer bonding / debonding step that these European Labs & Suppliers are still going on about has been eliminated by US companies who are now making 3-d stacked chip products commercially with a radically different material set & process flow.

 

 

resistion
User Rank
Author
vacuum-dependent bonding?
resistion   1/28/2014 2:59:28 PM
If the bonded wafer needs to go into a vacuum for further processing, it could slip off, right?



Radio
LATEST ARCHIVED BROADCAST
As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Most Recent Comments
bobdvb
 
Wilco1
 
DeeCee430
 
DeeCee430
 
moronda
 
rick merritt
 
Bruzzer
 
traneus
 
akkaraju
Like Us on Facebook
Special Video Section
The LTC®6363 is a low power, low noise, fully differential ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...