Breaking News
Oldest First | Newest First | Threaded View
zewde yeraswork
User Rank
zewde yeraswork   1/27/2014 11:43:31 AM
It may be necessary to strike a balance between high costs on the one hand and other limitations on the other hand.

User Rank
Progress in 3-d chip stacking has been held back by..
chipmonk0   1/27/2014 11:56:51 AM
too many Govt. funded European Labs getting involved and putting out misleading white noise branded as scientific research. They are neither result oriented nor sufficiently grounded in Physics or comprehensive methodologies to develop whole new technologies for commercial application. Rather than comprehend the total challenge they indulge only in piecewise optimization - the result : endless "Technical" Conferences that evade the core technical challenges but keep harping on cost & supply chain issues instead!

Only belatedly have these European "Researchers" recognized the folly of the process flow ( derived from "Powerpoint Engr." w/o the benefit of Physics, data or even Engr. common sense ! ) they have been blindly following and so now this article talks about the issues related to temporary bonding / debonding steps in 3-d stacking of wafers / dice !

The whole wafer bonding / debonding step that these European Labs & Suppliers are still going on about has been eliminated by US companies who are now making 3-d stacked chip products commercially with a radically different material set & process flow.



User Rank
vacuum-dependent bonding?
resistion   1/28/2014 2:59:28 PM
If the bonded wafer needs to go into a vacuum for further processing, it could slip off, right? Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Most Recent Comments
Max The Magnificent
Kevin Neilson
Max The Magnificent
Max The Magnificent
Like Us on Facebook
Special Video Section
Power can be a gating factor in success or failure of ...
Get to market faster and connect your next product to the ...
See how microQSFP is setting a new standard for tomorrow’s ...
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
Wireless Power enables applications where it is difficult ...
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...