Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
danielmuk
User Rank
Author
Re: Writing
danielmuk   10/16/2014 3:55:19 AM
What do you mean by post merger

junko.yoshida
User Rank
Author
Re: Integrating and specializing
junko.yoshida   2/9/2014 3:08:56 PM
NO RATINGS
@alex-m1, you shed an interesting light here. Yes, MTK's wearable solution ("Aster") is a multi-die solution. How that might change the SoC narrative is a good story to follow. Thanks for pointing that out. 

junko.yoshida
User Rank
Author
Re: Integrating and specializing
junko.yoshida   2/9/2014 3:06:25 PM
NO RATINGS
@daleste, thank you for adding clarity to pros and cons, here.

alex_m1
User Rank
Author
Re: Integrating and specializing
alex_m1   2/9/2014 10:50:13 AM
>> There are many SoC companies out there. Few have memory technologies.... 

Multi-die integration is starting to become interesting. XMOS is selling a mult-die mcu for less than $5 , media tek works on it's new wearable soc using mutiple die tech(and it has a done an impressive multi-die integrated microprocessor for low end phones for $3).

That might change the SoC story.

daleste
User Rank
Author
Re: Integrating and specializing
daleste   2/8/2014 12:58:48 PM
NO RATINGS
It is true that the flash process will add cost to the integrated solution, but the advantages outweigh the added cost.  Having a single die instead of two reduces the system cost and increases the reliability.  It also reduces the footprint required on the circuit board.  The flash will usually be more than half the die so you should think of this as adding logic to a flash chip instead of adding flash to a microcontroller.  The disadvantage is that the feature size of the logic will be lagging the industry in the combined process, so your logic will be larger than it would be on a stand alone chip.  As mentioned, the speed of reading and writing the flash will improve since it does not go off chip.

krisi
User Rank
Author
Re: Writing
krisi   2/7/2014 5:01:02 PM
NO RATINGS
I was wondering what is this "dissertation writing service" in the middle of the sentence in that post...

mikekirschner
User Rank
Author
Re: Writing
mikekirschner   2/7/2014 4:48:07 PM
NO RATINGS
Time to block this spammer...

junko.yoshida
User Rank
Author
Re: Integrating and specializing
junko.yoshida   2/7/2014 3:09:20 PM
NO RATINGS
@resistion, exactly. This is all about the speed of data, travelling between memory and logic.

resistion
User Rank
Author
Re: Integrating and specializing
resistion   2/7/2014 11:23:20 AM
NO RATINGS
It might be faster to read code from on-chip NVM.

zewde yeraswork
User Rank
Author
Re: Integrating and specializing
zewde yeraswork   2/7/2014 11:06:20 AM
NO RATINGS
I'm not sure that integrated embedded logic chips are the best option. It seems as though keeping them seperate, a flash chip and a logic chip apart from one another, may offer better value. 

Page 1 / 2   >   >>


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Like Us on Facebook
Special Video Section
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...