@DrFPGA: ...illustrates the power of the GPAK2 device...
I really do think these devices are very clever -- they've calved out a unique little niche and are happily selling hundreds of millions of units -- also they are really nice folks -- I hope they do really well.
Having the Dev board will be a major help! I have a few projects that I want to get to but having these may just make them work awesome. Thanks for the articles on these new devices. Keep up the good work.
@Robotics Developer ...at a 10 part minimal order how can you go wrong!
I agree -- that development board is also pretty cool (I think it was $59) -- you can drop one of these SMT chips into the carrier on the board and close the lid to bring it into contact with its pads -- then you can upload your design and appply real-world analog and digital stimulus (from the GUI on your PC) and verify your design works in a real-world part -- check out my original blogs (links at the top of this column) to learn more about this from when I was playing with the GPAK1 and GPAK2 devices.
@aeroengineer: It seams like a very interesting device that could find a lot of uses. I will have to take a closer look at it.
These really are rather tasty for gathering "glue logic" and stuff together -- check out my blogs on the GPAK1 and 2 devices (linked to at the beginning of this blog) to get a better idea as to what thsi is all about.
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.