Embedded Systems Conference
Breaking News
Newest First | Oldest First | Threaded View
<<   <   Page 3 / 3
User Rank
May be photonic connections can compete with prof. Kuroda
jasiojasiojasio   2/22/2014 11:14:49 AM
Of course there are no silicon lasers. But there are modulators (need CW light to power them) some of them literally micron size and very fast photodiodes. For 1500 nm light to propagate through that ~ 50 um thich wafer one of stack is easy. Light will go right through and do not wreck any havoc inside the die (1 layer). The dimensions of needed diffraction gratings will be way smaller than  sizes of RF links and silicon photonics can offer WDM on one beam. Given speed of those structures and very small size (and a few lasers bonded to top of 3-D structure) the throughput looks better than is wireless connection. Power consumption poses no problem. The crosstalk problem is way more easier to solve. Besides light beam goes through another and they are preserving their parameters. All these CMOS compatible. Thank you.

User Rank
alex_m1   2/22/2014 11:07:00 AM
Since they claim it's very inexpensive , does it fit microcontrollers , for integrating digital and analog dies or digital and flash dies ,for example?

User Rank
Re: Your take
DrFPGA   2/21/2014 11:35:44 PM
If SerDes are needed it will dramatically increase the amount of circuitry required. Perhaps a better approach would be to use something like a memory array of inductors. Anyone else remember core memory?

User Rank
Re: both wireless and TSV stacks have merits
tb100   2/21/2014 9:47:36 PM
Die are stacked for desnity reasons, not for price. Sometimes you just need more memory than will fit on a board, or on the DIMMs in your already full DIMM sockets. If these DIMMs already have the densest die, then you are out of luck--unless a vendor offers stacked die.

This is also used by FPGA companies to increase density or to add analog functions (ultra high-speed SerDes) to a digital chip.

User Rank
Re: Your take
chipmonk0   2/21/2014 5:45:15 PM
Great approach ! If it works then certainly beats doing root canal ( TSV ) on finished chips. But I am wondering if the chip to chip data transmission is going to be parallel or serial ?  If it is the former then how about SSN and Signal Integrity ? If serial then will it be like SerDes and require adding the necessary circuitry to ea. chip ( in addition to the pulse creating and sensing circuits ) ? In either case what physics would limit the Bandwidth ?

User Rank
Re: both wireless and TSV stacks have merits
buprestid   2/21/2014 5:14:34 PM
Can someone explain how 3-D stacking saves money, because the silicon die cost remains the same.

Is it primarily with the packaging cost? If so what percentage of the cost is packaging?

rick merritt
User Rank
Your take
rick merritt   2/21/2014 1:18:55 PM
I invite engineers interested in 3-D chip stacks to examine the foils from ThruChip and give your take on this approach.

User Rank
both wireless and TSV stacks have merits
wilber_xbox   2/21/2014 12:47:23 PM
The main problem in wireless is, as metioned, the manufactring of the coils. However difficult it may sound, if the cost and complexity is less in wireless stacking then TSV will be difficult to implement. Stacking seems like the only way to keep Moore's law in relevance.

<<   <   Page 3 / 3


Drones are, in essence, flying autonomous vehicles. Pros and cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight – as are piloted airplanes? Join EE Times' Junko Yoshida as she moderates a panel of drone experts.

Brought to you by

July 16, 1pm EDT Thursday
IoT Network Shoot Out
Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...