Optimizing the layout to get a nearly isothermal temperature distribution is a given these days in power conversion. The industry has evidenced a good pace of progress in this area not only in X-Y but also in the Z-direction as well. With that accomplished, thermal simulations and experimental measurements must therefore demonstrate whether encapsulating the power converter components is really a value-adding effort. The data sheet for the BCM module shows heatsink for the BCM, so one must wonder whether cooling requirement is less for the open frame version with / wiithout heatsink than that for the encapsulated one!
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.