Optimizing the layout to get a nearly isothermal temperature distribution is a given these days in power conversion. The industry has evidenced a good pace of progress in this area not only in X-Y but also in the Z-direction as well. With that accomplished, thermal simulations and experimental measurements must therefore demonstrate whether encapsulating the power converter components is really a value-adding effort. The data sheet for the BCM module shows heatsink for the BCM, so one must wonder whether cooling requirement is less for the open frame version with / wiithout heatsink than that for the encapsulated one!
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.