Optimizing the layout to get a nearly isothermal temperature distribution is a given these days in power conversion. The industry has evidenced a good pace of progress in this area not only in X-Y but also in the Z-direction as well. With that accomplished, thermal simulations and experimental measurements must therefore demonstrate whether encapsulating the power converter components is really a value-adding effort. The data sheet for the BCM module shows heatsink for the BCM, so one must wonder whether cooling requirement is less for the open frame version with / wiithout heatsink than that for the encapsulated one!
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.