Optimizing the layout to get a nearly isothermal temperature distribution is a given these days in power conversion. The industry has evidenced a good pace of progress in this area not only in X-Y but also in the Z-direction as well. With that accomplished, thermal simulations and experimental measurements must therefore demonstrate whether encapsulating the power converter components is really a value-adding effort. The data sheet for the BCM module shows heatsink for the BCM, so one must wonder whether cooling requirement is less for the open frame version with / wiithout heatsink than that for the encapsulated one!
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.