@Kinnar, miniaturization is an interesting topic all around. The goal in electronics has always been smaller, faster, cheaper. However, the smaller piece of the equation is making things more difficult on a variety of fronts. For example, this miniaturization trend is making it challenging to reclaim components and materials from electronics as part of sustainability efforts. THe parts are so small that it's difficult both at teh start of the product life and at the end.
The simulation environments have become so advanced they are coming up with smaller design technique and it will surely be costly affair for foundries to consider those miniaturisation moulding in the physical chips.
Fabs are expensive. Just keeping the fab in tip-top shapes will requires billions nowadays. Let alone building new fabs. Actually other than Samsung's NAND fab being built in Xi'an, China, I am not aware of major new fabs being built anywhere. Intel recently cancelled their planned Fab 42 in Arizona.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.