Very good point @Bert22306...the challenge is to implement all 7 layers of the OSI protocol stack on one chip...this will be very ddiffult for IoT but since the amount of information to be transmitted and stored is rather small it should be possible...in traditional Internet networking there is no hope to implement all 7 layers on one chip...in fact just few years ago you had a separte device for each, PHY for physical, MAC for layers 2, IP engine for layer 3 etc...Kris
I agree with Kris. There's no new principle at play here. If you want to define the functional layers involved in IoT, the 7 layer ISO/OSI model is just as good as any. I think the point of the article was to show how all 7 layers may be provided in a single chip.
Again, IoT device needs to communicate so there has to be classification in terms of the 7 layers oif the standard protocol stuck...I am not really sure why you are trying to invent something special for IoT while teh fundation has been laid down a while back and can be found in every textbook on this topic...only implementation details will be different...Kris
I taught VLSI class many years back...a picture like this was used by me (and many others) to illustrate concept of system on chip (SoC)...in some sense most complex ICs start to look like this (some blocks might be missing in some implementations) so I am not sure what is the fuss about ;-)
Congrats !! As usual, you came with a good point of discussion.SiLabs is trying to "pull the sardines to his side" , as we say in Brazil.In my current vision , this drawing is a kind of IOT Level 2. So there is at list one level below and several levels above. For example, Intel is "selling"the idea that IOT uses Edson, with a Pentium CPU inside. What we would call an IOT Level 4. And why not the cell phones are IOT also ? Why not IOT Level 6?So we are discovering that IOT is bigger and bigger, and we will have to start to classify them , linked to a certain groups of applications.
Didn't the mediatek chipset for wearables integrated everything ? it did this by integrating multiple dies, but mediatek can do this relatively cost effectively i believe. They have something using this kind of integration used in dumb phones ,being sold at $2.1 .
Besides the block diagram, one of the interesting parts of my conversation with Silicon Labs was their view of "sensor hubs" and how that relates to their vision of IoT SoC.
While Silicon Labs' current focus is not exactly in gathering and integrating multiple types of sensors -- 3D sensors, 3G sensors, etc. -- into a hub, the company views the end game of IoT SoCs in performing sensor hub operations and wireless connectivity all together.
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