Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 3 / 3
Gondalf
User Rank
Manager
Re: FD-SOI and AMD
Gondalf   4/5/2014 6:11:25 PM
NO RATINGS
1 saves
No Amd has shifted to bulk definitively.

The STM micro bias has omitted the necessity of dual patterning at 20nm FD SOI, double patterning and some quadruple at 14nm FD SOI etc....

The interconnection thikness is not related with the type of transistor and with exotic substrates. 

The real cost is in interconnection and most of the costs of research are devoted to its improvement at the finest nodes.  

Fottemberg
User Rank
Rookie
FD-SOI and AMD
Fottemberg   4/5/2014 5:13:56 PM
NO RATINGS
Will AMD produce CPUs or GPUs on FD-SOI during 2014?

Gondalf
User Rank
Manager
STM micro bias
Gondalf   4/5/2014 3:59:50 PM
NO RATINGS
Estimated....estimated....estimated.

Nobody knows the real wafer cost at TSMC or Intel on 22/20nm , not even STM.

Moreover STM has yet to give hard numbers about superiority of FD SOI versus FinFet in high power, medium power, low power, very low power transistors.

STM is obscure....smoky. What about the comparison between FD SOI and Bulk??? why not between FD SOI and Bulk + FinFet ??? strange thing indeed !!

All the industry is going to FinFet, following Intel that has a three years lead and experience over all contenders in high volume shipment of FinFet devices.

I assume that Intel has chosen FinFet over SOI because it gives the better performance, the lower power consumption and the lower per wafer cost at 22/14/10nm nodes.

No matter what is saying STM, all the foundries have done definitively their choice.......FinFet. The history is written right now.

resistion
User Rank
Manager
Self-heating
resistion   4/4/2014 9:46:42 PM
NO RATINGS
1 saves
Although double patterning is certainly a signficant barrier, a more aggressive shrinking (<0.7x) could bring back some more returns. Actually, the greater concern for me is the self-heating that could be aggravated in these thin silicon devices (FDSOI and FinFET). It's harder for heat to move away from hot spots in thin silicon. Even in the Intel trigate case, it has to move down from the narrowest point (the apex).

<<   <   Page 3 / 3


Flash Poll
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Rishabh N. Mahajani, High School Senior and Future Engineer

Future Engineers: Don’t 'Trip Up' on Your College Road Trip
Rishabh N. Mahajani, High School Senior and Future Engineer
Post a comment
A future engineer shares his impressions of a recent tour of top schools and offers advice on making the most of the time-honored tradition of the college road trip.

Max Maxfield

Juggling a Cornucopia of Projects
Max Maxfield
2 comments
I feel like I'm juggling a lot of hobby projects at the moment. The problem is that I can't juggle. Actually, that's not strictly true -- I can juggle ten fine china dinner plates, but ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
28 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Karen Field

July Cartoon Caption Contest: Let's Talk Some Trash
Karen Field
127 comments
Steve Jobs allegedly got his start by dumpster diving with the Computer Club at Homestead High in the early 1970s.

Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)