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chipmonk0
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" ... details .. " Oh really ?
chipmonk0   4/25/2014 11:26:49 AM
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One usually expects more details in an article titled " ... details .. " ! For a start how about figures / photos showing various 3-d stacks mentioned as a proof of existence but also some dimensions / performance / yield data. Otherwise its more of the same old hype that has dogged the reporting of 3-d stack technology development.

sung kyu lim @ GTCAD
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Re: typo?
sung kyu lim @ GTCAD   4/24/2014 3:31:07 PM
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oh well, i wish i could, but i am just a humble designer dying to reduce TSV area overhead in my 3D IC designs... i am eargerly waiting for TSMC to produce smaller TSVs at lower cost ;-)

HBR1
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Re: typo?
HBR1   4/24/2014 3:03:49 PM
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Hi Sung Kyu, you are right - it should say MICROmeter. This was wishful thinking on my part. Can YOU take on this challenge and make my wish come true ?....Herb

sung kyu lim @ GTCAD
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typo?
sung kyu lim @ GTCAD   4/24/2014 2:44:43 PM
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40nm pitch for TSV? you mean 40um?

sranje
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Congratulations to Herb
sranje   4/24/2014 2:21:31 PM
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An excellent summary - measured, balanced, informative -- a pleasure to read your articles Herb



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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