Our Super SMT Component Enclosure is the world's only enclosure for electronic components storage, which has > 100 compartments for enclosing SMT components, such as chip resistors, capacitors, inductors, ICs, etc. This enclosure has 128 individually lidded compartments, all covered by a top cover. There is a foam pad under the top cover, which presses down all the 128 lids onto their closing positions, thus, they can tolerate strong vibration and shock without opening, so that the parts inside will never be leaked out.
On the bottom of the enclosure, it comes with 2 strips of rubber feet, they will lock into the 2 slots onthe top cover of another enclosure when stacking enclosures together.
On the top surface, there is a label area, in which a label can be placed or marks can be hand written, for identifying the internal contents of the enclosure.http://www.analogtechnologies.com/enclosure.html
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.