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Kinnar
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Re: Misleading Headline?
Kinnar   5/30/2014 9:56:17 AM
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That's really a great news and fact figure, and the volumetric production and the huge demand of memory is actually in strict demand of such technology and yes it is really a very good news that people are working hard to make this idea usable in volumetric productions of ICs. 

Kinnar
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Re: Misleading Headline?
Kinnar   5/30/2014 9:50:44 AM
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That will require another incremental development to correctly mould this idea in actual practice including cost concerns.

R_Colin_Johnson
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Re: credible reporting on science & technology requires avoiding Hype
R_Colin_Johnson   5/29/2014 5:50:01 PM
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how many of those 30 customers for this AMAT tool are using it for TSVs

I assumed that all 30 are using Ventura for TSVs, but I just checked with Applied Materials to make sure my memory served me well, and they confirmed that Applied Materials has "sent 30 chambers to multiple customers.  And yes, Ventura was developed specifically for fabricating TSVs."

Thank you very much for your query. Its good to make sure that all our published facts are checked and verified. Thanks again.

chipmonk0
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credible reporting on science & technology requires avoiding Hype
chipmonk0   5/29/2014 4:13:49 PM
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and how many of those 30 customers for this AMAT tool are using it for TSVs ??

R_Colin_Johnson
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Re: Misleading Headline?
R_Colin_Johnson   5/29/2014 1:43:54 PM
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I don't write the final headline, my suggested headline read:

World's First 3-D TSV Volume Manufacturing Tool

But in defense of our headline writers, AM does already have 30 customers, some working with the tool for as long as 18 months, which "sends" could resonably be argued to accurately describe :)

wilber_xbox
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Re: Misleading Headline?
wilber_xbox   5/29/2014 1:37:16 PM
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I also think that these are incremental improvements but whether there are enough for companies to switch to 3D stack for cost is not yet clear.

Kinnar
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Re: Misleading Headline?
Kinnar   5/29/2014 2:54:15 AM
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You are right; this is actually a incremental development or stepping stone for the high volume production of 3D Chips. This kind of incremental developments are really required in increasing manufacturability of 3D Chips.

Francoise.vonTrapp
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Misleading Headline?
Francoise.vonTrapp   5/28/2014 11:35:00 PM
While I agree that AMAT's HVM tool for PVD of barrier and seed layers is exciting news, lets not get ahead of ourselves by making false claims in the title just to get the click-throughs. TSVs will go into HVM when the volume orders start rolling in from customers. A more accurate title would be "HVM PVD Tool Enables Industry to Manufacture 3D IC Stacks in High Volume." 

R_Colin_Johnson
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Re: Ti barrier metal
R_Colin_Johnson   5/28/2014 6:20:51 PM
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Using Ti instead of tantalum as barrier cuts cost according to AM. Cu goes inside the barrier--as usual.

Martini Tech
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Re: Ti barrier metal
Martini Tech   5/28/2014 3:06:04 PM
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Cu as filling of TSV has already been used since long time ago.

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