Embedded Systems Conference
Breaking News
Comments
Oldest First | Newest First | Threaded View
Page 1 / 2   >   >>
selinz
User Rank
Author
Ti barrier metal
selinz   5/28/2014 2:07:02 PM
NO RATINGS
So is the innovation using Ti as a barrier in sputtering Cu? Or is that just incidental information?

Martini Tech
User Rank
Author
Re: Ti barrier metal
Martini Tech   5/28/2014 3:06:04 PM
NO RATINGS
Cu as filling of TSV has already been used since long time ago.

R_Colin_Johnson
User Rank
Author
Re: Ti barrier metal
R_Colin_Johnson   5/28/2014 6:20:51 PM
NO RATINGS
Using Ti instead of tantalum as barrier cuts cost according to AM. Cu goes inside the barrier--as usual.

Francoise.vonTrapp
User Rank
Author
Misleading Headline?
Francoise.vonTrapp   5/28/2014 11:35:00 PM
While I agree that AMAT's HVM tool for PVD of barrier and seed layers is exciting news, lets not get ahead of ourselves by making false claims in the title just to get the click-throughs. TSVs will go into HVM when the volume orders start rolling in from customers. A more accurate title would be "HVM PVD Tool Enables Industry to Manufacture 3D IC Stacks in High Volume." 

Kinnar
User Rank
Author
Re: Misleading Headline?
Kinnar   5/29/2014 2:54:15 AM
NO RATINGS
You are right; this is actually a incremental development or stepping stone for the high volume production of 3D Chips. This kind of incremental developments are really required in increasing manufacturability of 3D Chips.

wilber_xbox
User Rank
Author
Re: Misleading Headline?
wilber_xbox   5/29/2014 1:37:16 PM
NO RATINGS
I also think that these are incremental improvements but whether there are enough for companies to switch to 3D stack for cost is not yet clear.

R_Colin_Johnson
User Rank
Author
Re: Misleading Headline?
R_Colin_Johnson   5/29/2014 1:43:54 PM
NO RATINGS
I don't write the final headline, my suggested headline read:

World's First 3-D TSV Volume Manufacturing Tool

But in defense of our headline writers, AM does already have 30 customers, some working with the tool for as long as 18 months, which "sends" could resonably be argued to accurately describe :)

chipmonk0
User Rank
Author
credible reporting on science & technology requires avoiding Hype
chipmonk0   5/29/2014 4:13:49 PM
NO RATINGS
and how many of those 30 customers for this AMAT tool are using it for TSVs ??

R_Colin_Johnson
User Rank
Author
Re: credible reporting on science & technology requires avoiding Hype
R_Colin_Johnson   5/29/2014 5:50:01 PM
NO RATINGS
how many of those 30 customers for this AMAT tool are using it for TSVs

I assumed that all 30 are using Ventura for TSVs, but I just checked with Applied Materials to make sure my memory served me well, and they confirmed that Applied Materials has "sent 30 chambers to multiple customers.  And yes, Ventura was developed specifically for fabricating TSVs."

Thank you very much for your query. Its good to make sure that all our published facts are checked and verified. Thanks again.

Kinnar
User Rank
Author
Re: Misleading Headline?
Kinnar   5/30/2014 9:50:44 AM
NO RATINGS
That will require another incremental development to correctly mould this idea in actual practice including cost concerns.

Page 1 / 2   >   >>


Radio
LATEST ARCHIVED BROADCAST
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...