@krisi As referenced in the article, one of the alignment challenges is the tolerance stackup for microbumps and TSV's. I have seen IMEC's roadmap where the microbumps are less than 30um in dia and the TSV's are heading lower than 5um. Without the submicron alignment accuracy needed, wafer to wafer bonding will not be realized!
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.