"creating GaN LEDs on glass substrate, which could not only cut manufacturing costs but also help to develop OLED light panels." Author should edit this since GaN is inherently NOT OLED. This paper only demonstrated GaN LED on a silicon wafer with an SiO2 layer. Nice academic paper but the prospects of fabrication on organic substrate is just another academic buzzword funding pitch.
This is really a great remarkable research, this will really make the read LED Televisions/Video Monitors possible. We see and call LED TV and LED Monitor are all Liquid Crystal Displays (LCDs) with LEDs being used as back light. Chana is pioneer and leading manufacturer of Actual LED based large scale displays. But still today I have not heard any leading manufacturers involved in Actual LED based Video Dispalys. With this research of growing RGB LEDs on the Glass subtract will really make the Actual LED based displays more feasible.
Japan is a way ahead in many technologies, like mobile telephony, displays, audio and automobile. It is because of technologies development and documentation in their own local language it takes time to reach to the world.
@tfungus You are quite right, OLEDs have organometallics in the emissive layer, GaN on glass substrate does not qualify as one.
The author is quite correct in that the current processing technologies using MOCVD for InGaN on either bulk GaN or SiC or Sapphire or Si substrates is some what limited to 6inch max wafer size (bulk GaN is even lower). This invariably leads to higher cost. And the cost reduction curve will most likely NOT follow the CMOS models if and when larger substrates become viable.
@chanj0 I am some what hopeful about costs coming down IF roll-to-roll processing can be implemented. But I agree with you that reliability of devices on flexible glass substrates needs to be proven first. Therein, ITO on flexible glass substrates has already been proven and Corning offers solution today for manufacturing. This can be leveraged for GaN LEDs.
There is always the option to go to rigid glass substrates in panellized form (where reliability has already been proven for 2.5D interposers) but this may be not as attractive from a cost perspective.
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