"No matter what Intel says, Moore's Law is slowing down," said Bob Johnson, a semiconductor analyst for Gartner. "Only a few high-volume, high-performance apps can justify 20 nm and beyond." He sees problems ahead for logic chips in general. The smartphone market is nearing saturation, ultramobiles are canabalizing PCs, and "logic is running out of gas."
If logic is getting affected, that's a really big problem.
a 2 x 64 bit bus carrying 25 GByte/s for LP DDR ( Dual Data Rate ) means a Clock Rate of 800 MHz, not at all unusual for LP DDR 3, it works even with conventional lossy Packages.
Apple has been using them for the 5s since last Fall, had to shrink Package interconnect pitch to accomodate wider channels, but that's still a conventional PoP package. SK Hynix claims their LP DDR 3 can run at Clock Rates double that but have n't seen a SoC - DRAM module packaged in conventional PoP working at 1.6 GHz yet.
We do special loss - less Packages that clean up the Eye Diagram even at much higher Clock Rates for very high Bandwidth and low Power loss w/o having to drill any TSVs into live chips.
Rick, a guy from zvi orbach's company talked about 3d chips as a strong way to fight defects. Self assembly and Molecular Imprints suffer strong defect rate, but at least they have the resolution. I wonder how well a combination will to solve the defect issue will work cost wise ?
Resistion: the way i understood it , you build 2 equivalent layers on top of one another, And for gate(or cell) you choose which layer 2 use after manufacturing - using boundary scan for detection and e-beam for the repair. more details in .
Assuming defects are uncorrelated between layers(big assumption), this greatly decreases you defect probability.
Thanks, alex_m1. The concept of this repair layer sounds interesting, but of course, it's still cheaper to have all the layers within defect tolerances to begin with (so then you could go on to heterogeneous integration).