Thermally conductive materials include thermal pads and thermally conductive epoxy.
ATCR1R5 series thermal pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40～150ºC. The flame rating is UL94 V0.
Material: Silicon gel &ceramic Color: Dark gray Density: 2.5 g/cc Dielectric coefficient: 5.75 @1MHZ
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.