Thermally conductive materials include thermal pads and thermally conductive epoxy.
ATCR1R5 series thermal pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40～150ºC. The flame rating is UL94 V0.
Material: Silicon gel &ceramic Color: Dark gray Density: 2.5 g/cc Dielectric coefficient: 5.75 @1MHZ
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.