You said: "3D packaging with through silicon vias is five to ten years out"
I beg to differ! Tezzaron is doing it now. They combine different process flows, different geometries, different substrates, different die dimensions... All manufactured for their customers as 3D-ICs with TSVs. It's very exciting.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.