You said: "3D packaging with through silicon vias is five to ten years out"
I beg to differ! Tezzaron is doing it now. They combine different process flows, different geometries, different substrates, different die dimensions... All manufactured for their customers as 3D-ICs with TSVs. It's very exciting.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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