You said: "3D packaging with through silicon vias is five to ten years out"
I beg to differ! Tezzaron is doing it now. They combine different process flows, different geometries, different substrates, different die dimensions... All manufactured for their customers as 3D-ICs with TSVs. It's very exciting.
Drones are, in essence, flying autonomous vehicles. Pros and cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight – as are piloted airplanes? Join EE Times' Junko Yoshida as she moderates a panel of drone experts.