Breaking News
Comments
Newest First | Oldest First | Threaded View
markabra
User Rank
Author
Re: 3D packaging with through silicon vias
markabra   8/8/2014 4:09:22 PM
NO RATINGS
Ditto that!

Tezzaron is doing some exciting things right now!

5 to 10 years out is a false statement. Do a little research on what this company has accomplished since 2004.

Astronut0
User Rank
Author
3D packaging with through silicon vias
Astronut0   8/8/2014 12:55:45 PM
NO RATINGS
You said: "3D packaging with through silicon vias is five to ten years out"

I beg to differ!  Tezzaron is doing it now.  They combine different process flows, different geometries, different substrates, different die dimensions...  All manufactured for their customers as 3D-ICs with TSVs.  It's very exciting.



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
Protecting sensitive electronic circuitry from voltage ...
09:45
Watch as a web server authenticates or rejects a water ...
Protecting sensitive electronic circuitry from voltage ...
Watch as a web server authenticates or rejects a water ...
Protecting sensitive electronic circuitry from voltage ...
Power can be a gating factor in success or failure of ...
Get to market faster and connect your next product to the ...
00:44
See how microQSFP is setting a new standard for tomorrow’s ...
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27