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Astronut0
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3D packaging with through silicon vias
Astronut0   8/8/2014 12:55:45 PM
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You said: "3D packaging with through silicon vias is five to ten years out"

I beg to differ!  Tezzaron is doing it now.  They combine different process flows, different geometries, different substrates, different die dimensions...  All manufactured for their customers as 3D-ICs with TSVs.  It's very exciting.

markabra
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Re: 3D packaging with through silicon vias
markabra   8/8/2014 4:09:22 PM
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Ditto that!

Tezzaron is doing some exciting things right now!

5 to 10 years out is a false statement. Do a little research on what this company has accomplished since 2004.



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