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Astronut0
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3D packaging with through silicon vias
Astronut0   8/8/2014 12:55:45 PM
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You said: "3D packaging with through silicon vias is five to ten years out"

I beg to differ!  Tezzaron is doing it now.  They combine different process flows, different geometries, different substrates, different die dimensions...  All manufactured for their customers as 3D-ICs with TSVs.  It's very exciting.

markabra
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Re: 3D packaging with through silicon vias
markabra   8/8/2014 4:09:22 PM
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Ditto that!

Tezzaron is doing some exciting things right now!

5 to 10 years out is a false statement. Do a little research on what this company has accomplished since 2004.



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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