Yes head to head comparisons are tough, but in this case Intel is not showing a PowerPoint but an actual product. TSMC will not ship anything they define as 14nm for at least a year, and in volume even later. Historically their SHIPPING SRAM sizes have been 10-20% larger than what has been advertised in papers, probably to meet SNM and other requirements.
Buprestid You do realize you are comparing a shipping product to a conference paper presentation. Real SRAM cell sizes are substantially larger than what is advertised at conferences. I guess in a few years wwhen they get aroundto sshipping 14nm we will know.
Congratulations to the Intel team on a phenomenal engineering achievement. Keeping the cost per transistor going down by doing higher aspect ratio fins, boosting drive current and lowering transistor area needed is great.
I wonder, though, whether Intel can really boast that Moore's Law is alive and well... the yield challenge of high aspect ratio fins cost a year of delays (thereby the cost per transistor went down by 2x after 3 years instead of 2)... it also caused loss of face for Intel with major customers like Apple.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.