Breaking News
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
User Rank
SRAM size comparison
AKH0   8/12/2014 6:21:58 PM
Actually the smallest cell published so far is the "10nm" cell shown at VLSI earlier this year. With a gate pitch of 64nm, metal pitch of 48nm, and the same fin pitch of 42nm, it was a bit smaller at 0.053 um2.

Also, a fair comparison for Intel vs Intel would be the 0.108um2 cell in 22nm which had the same 2-fin NFET design that was shown here. The 0.092um2 cell had only one fin per transistor. The 2-fin cell here has a width of 420nm. A single-fin cell would had a width of (420-84 nm) and an area of roughly 0.047um2, which would put it at 0.51X compared to the corresponding 1-fin cell in 22nm. However, a single-fin SRAM would have poor charactersitics, because it does not have the right beta ratio (PD>PG>PU).


User Rank
Transistors vs. interconnects
beinglass   8/12/2014 6:12:55 PM
The new report from Intel detailing the long awaiting 14nm process shows an amazing transistor structure with 2 new features.

1. Higher fins 42 vs.34nm of 14 vs. 22nm nodes

2. Non tapered (vertical fins) which is quite deviation from the 22 nm process.

I'm not sure what will the competitors (Samsung, TSMC GF) are planning for their fins' shape. It will be very interesting to see.

However I have not seen any revelation with regards to the back end and especially with the interconnect section of the process (BEOL). Looks like the transistors are getting better and better but the BEOL is basically stays the same. In that case are we seeing diminished return? Or the solution will be to yet adding more metal layers, also what about first metal layers CD, how small narrow can we make them.

User Rank
Re: Intel's response to this article...
ScottenJ   8/12/2014 5:59:41 PM
Intel previously stated that wafer cost increased by 27% for 14nm over 22nm. The SRAM cell size at 22nm was 0.092um2 and for 14nm is 0.588um2. 1.27x cost divided by 1.56 density = 0.81 cost.

3D Guy
User Rank
Intel's response to this article...
3D Guy   8/12/2014 4:57:27 PM
I'm curious to see how Intel responds to this article. From what Mr. Or-Bach says here, it looks like their announcements of SRAM cell size may not be consistent with each other. Intel keeps saying Moore's Law is alive and well, but is cost per transistor really scaling once every 2 years as it used to? Isn't there a 2.5-3 year gap between 22nm and 14nm? Looking forward to hearing Mark Bohr/Intel's response. Maybe EETimes can contact him for comment? 

<<   <   Page 2 / 2 Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Most Recent Comments
Like Us on Facebook
Special Video Section
LED lighting is an important feature in today’s and future ...
The LT8602 has two high voltage buck regulators with an ...
The quality and reliability of Mill-Max's two-piece ...
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...