ATCR1R5 series thermal pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40～150ºC. The flame rating is UL94 V0. With good thermal conductivity, wide temperature range and low price, this pad could be a cost-effective one.
Thermal conductivity: 1.5W/m.k Low pressure applications Size：200×200×0.5 mm Natural tack Electrical insulating High temperature resistance 100 % Lead (Pb)-free and RoHS Compliant
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.