ATCR1R5 series thermal pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40～150ºC. The flame rating is UL94 V0. With good thermal conductivity, wide temperature range and low price, this pad could be a cost-effective one.
Thermal conductivity: 1.5W/m.k Low pressure applications Size：200×200×0.5 mm Natural tack Electrical insulating High temperature resistance 100 % Lead (Pb)-free and RoHS Compliant
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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