ATCR1R5 series thermal pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -40～150ºC. The flame rating is UL94 V0. With good thermal conductivity, wide temperature range and low price, this pad could be a cost-effective one.
Thermal conductivity: 1.5W/m.k Low pressure applications Size：200×200×0.5 mm Natural tack Electrical insulating High temperature resistance 100 % Lead (Pb)-free and RoHS Compliant
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.