According to a new market research report "System in Package (SIP) Market by Technology (2D, 2.5D & 3D), by Type (BGA, SMT, QFP, SOP), Interconnection Technology (Flip-Chip & Wire-bond), Applications (Communications, Consumer, Automotive, Medical) and Geography (N. America, Europe, APAC & ROW) Global Trends & Forecasts to - 2014 - 2020", the total System in Package (SiP) market is expected to reach $18.10 billion by 2020, growing at a CAGR of 9.57% from 2013 to 2020.
Browse 76 market data tables, 59 figures spread through 277 pages and in-depth TOC on "System in Package (SIP) Market".
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The advance packaging has given a rise to innovative safety systems in automotive and transportation sector which will drive the System in Package (SiP) market; for example, Local Interconnect Network (LIN) solutions within the vehicle for operating the devices was introduced by Atmel Corporation (U.S.). In the overall System in Package (SiP) market, the consumer electronics sector will be the highest revenue generator and lead the market from the demand side. Semiconductor industry has a trend of outsourcing advance packaging and testing services, in which, most of the players are from the Asia-Pacific region.
The concept of System in Package (SiP) came into major attention when increasing demands for miniaturization and higher functionality at lower cost process was introduced by advance semiconductor packaging industries. As the ICs and the major electrical component were packaged into a single module, this had increased the overall performance, reliability, and efficiency of the module.
The report's detailed segmentations by technology, packaging type, interconnection technology, applications, and geography cover all the existing and emerging technologies in the System in Package (SiP) market. The major packaging technologies that have been extensively covered in the report are 2D, 2.5D, and 3D IC packaging; the packaging types covered are Ball Grid Array (BGA), Surface Mount Technology (SMT), Quad Flat Package (QFP), and Small Outline Package (SOP); and the interconnection technologies for packaging are flip chip and wire bond technologies.
The application segmentation of the market covers all the major applications like consumer electronics, communication, medical, industrial, automobile and transportation, and military, defense, and aerospace in detail.
One of the objectives of the research study was to analyze the market trends for each of the System in Package (SiP) technologies; and the growth rates of the various packaging type and interconnection technologies.
Apart from market segmentation, the report also includes in depth analysis like the Porter's five force analysis, value chain with detailed process flow diagram, and market dynamics such as drivers, restraints, and opportunities for the overall System in Package (SiP) market.
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