"This will take time. It is a journey. I fully expect us to see initial use cases for SCM that do in fact add a layer to storage/memory hierarchy. That's OK. It's part of the learning and discovery cycle."
"As an industry, we all are working toward SCM and we'll all make progress in different ways. But there's really nothing too controversial about any of it."
"SCM would allow us to have extremely high-density connections to processors. But, today, processor vendors limit the physical connections, or how much memory can be attached." (It's pin-limited)
On their public roadmap last year in Dec, WD had 3D ReRAM in second half of 2018. Assuming that's start of production, they should ship in 2019. If the timing has changed since, no idea. Intel announced XPoint as ready when they knew it's not even close to ready but wouldn't expect that kind of behavior from WD/Toshiba.
I think there was a Dilbert cartoon with a theme like this! Managers demanding you be innovative typically does not work. Get the mangement out of the process and perhaps you will come up with some innovative ideas! Most companies will never put up with that as it leaves the power struture vulnerable.
"The hard drive market is flattening and declining slightly over time"
That's a very unrealistic view. The hard part is yet to start for HDDs. PCs will decline faster and faster going forward (on foldable displays in mobile and later on glasses) while NAND attach rates in PC and console are relatively low and can only improve.
Worst case scenario, China breaks through in NAND, the market enters a state of permanent oversupply around year 2020 and NAND pricing becomes very favorable. At that point HDDs are dead in consumer (PC, CE, branded) and the only application fit for them is cold storage - even that would only last for a few more years.
Would have been interesting to ask him about SCM, Marvell seems the right partner for Western Digital in developing controllers for WD's 3D ReRAM.