Latest News
Headlines for Saturday, February 4, 2012
Business
Appleton's death could delay DRAM consolidation
Headlines for Friday, February 3, 2012
Business
New IBM CEO sees her salary doubled
IBM SmartCamp startups attempt to solve world problems
Micron's Steve Appleton dies in plane crash
Panasonic predicts loss of $10 billion for fiscal year
Sonics, Tensilica team to improve IP efficiency
Microchip posts weak fiscal Q3, outlook brighter
Extra!
ARM Mulls Non-Volatile Memory IP acquisition 
Product
STMicro extends appliance control offerings
Headlines for Thursday, February 2, 2012
Business
NXP gives sneak peek at new engineering workbench app
Video: HP's Prith Banerjee discusses HP labs, ARM servers and optical interconnects
AMD: New faces, new road maps, new focus
Elpida posts big loss, denies Micron deal
ASPs weigh as Hynix' losses reduced in Q4
CMOS timing startup raises $2.3 million
Infineon profits trimmed by lower sales
TSMC plans 3-D IC assembly launch early in 2013
Cadence a billion dollar company once again
U.S. probes Qualcomm's foreign business practices
Conferences & Shows
Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects
Technology
HP rolls OpenFlow code for its switches
U.K. to spend $120 million on graphene institute
CNSE receives federal grants for nanotechnologies
Qualcomm, Ericsson demo LTE-to-3G handover
Headlines for Wednesday, February 1, 2012
Business
Panel probes T&M’s tech chiefs
Viewpoint: 'The R&D credit doesn't work'
How to solve $16.7 billion product returns problem
Time to play hard ball on tech manufacturing
Discipline key to engineering innovation, says Microsoft exec
Mali graphics to lead in smart TVs, says ARM's East
Technology
HP R&D chief shows road to terabyte backplane
CEA-Leti opens 3-D IC packaging service
Conferences & Shows
CEO of iFixit blasts Apple for tiny torx screws
New versions of Wi-Fi expected to boost tablets
Lines blurring between digital, analog design worlds
Product
Movidius teams with Toshiba on 3-D camera system
Headlines for Tuesday, January 31, 2012
Technology
Wanted: 3-D IC standards within six months
E-reader uses Qualcomm's mirasol display
Business
Updated: Printed battery maker expands in Wisconsin
Why DesignCon? An editorial overview
LTE spending projected to boom in 2013
IHS forecasts 3.3% chip growth in 2012
North America increases share of chip sales in 2011
ARM sales, profits rise as partners gain market share
Product
SGI packs 144 drives in 4U server
Intel samples Atom server SoC, snags Xeon win
ARM tips 'gods and giants' roadmap
Extra!
Marvell’s Weili Dai bets on Kinoma for TV, Mobile Strategies
Design
DesignCon panel: No magic bullet for crosstalk
Headlines for Monday, January 30, 2012
Business
AMD's CTO talks heterogeneous systems architecture
MEMS foundry IMT names semi vet CEO
Intel invests in network security firm
MStar revealed as ARM graphics IP licensor
Arteris counters Sonics' patent infringement claims
Intel patents purchase tips RealNetworks partnership
EE Times' Coverage of DesignCon
Extra!
Neul 'White Space' Radio ICs to Sample in 2012
Product
Tilera appoints CEO, announces processors
Technology
DesignCon: Avago, TI hit signal milestones
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