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DAC Technology Trends: Confronting timing and signal integrity








EEdesign.com


Deep submicron design is no longer just about timing closure - designers must also cope with signal-integrity and power challenges. At 0.18 microns and below, considerations such as crosstalk, IR drop, power dissipation, and electromigration begin to take center stage - but tools and methodologies are in scarce supply today. The following contributed articles, from both vendors and users, will help you find some solutions to signal-integrity and power challenges.










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