Dongbu (Seoul) said the memory chip developed jointly with Taiwanese flash-memory designer Eon Silicon Solution Inc. (Hsinchu) comes in 32-, 64- and 128-megabit configurations, supporting 3.3-voltage operations.

Dongbu will begin making chips on a foundry basis for Eon in September. Dongbu anticipates ramping wafer starts of the new process at the 130-nm node to 3,000 per month during 2007.

The company also claims its 0.13-micron process-based chip is price competitive. The chip’s memory cell-size claims to be smaller than that of U.S. chip maker Intel Corp.’s 0.13-micron-level NOR flash, allowing higher productivity. It did not elaborate on the size.

Dongbu has two 8-inch fabs. One fab is capable of 0.16-micron design rules, while the other is said to process wafers down to 0.13-micron.

After keeping a low profile in the marketplace, the company in 2001 entered the silicon foundry business. The company, a unit of the conglomerate Dongbu Group, began processing wafers in its new 8-inch wafer fab in Korea.

In 2002, Amkor Technology Inc. completed the sale of 20 million shares in foundry provider, Anam Semiconductor Inc., to the Dongbu Group for $93 million. In effect, the deal gave the Dongbu Group a controlling interest in two foundry companies: Anam and Dongbu Electronics. The entities were combined and renamed DongbuAnam, now called Dongbu.