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NXP, Ceva form IP alliance
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EE Times


SAN JOSE, Calif. — Intellectual-property (IP) chip provider Ceva Inc. and NXP Semiconductors have formed an alliance.

NXP has chosen Ceva's CEVA-Teak DSP core for its low-cost single-chip solutions targeting entry-level handset designs for emerging markets. CEVA-Teak is a 16'bit fixed-point general-purpose DSP core.

NXP's single-chip solutions, PNX4901 and PNX4903, is an integrated single-chip phone solutions, based on GSM/GPRS technology.

NXP is the latest semiconductor company to announce the adoption of CEVA DSP technology as the DSP architecture of choice for handset designs. The list for the technology includes Broadcom, Chipnuts, EoNex, Infineon, InterDigital, Renesas, ROHM, Sharp, Spreadtrum and VIA.






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