LONDON — DSP core licensor Ceva Inc. (San Jose, Calif.) has partnered with foundry Semiconductor Manufacturing International Corp. (Shanghai, China) to demonstrate functioning silicon of its TeakLite-III DSP Core.
Ceva announced the 32-bit Teaklite-III in May 2007.
Both TSMC and UMC have already had numerous customers produce working silicon using TeakLite-III. The SMIC announcement, in addition to highlighting the first silicon from that particular foundry, also is meant to highlight the fact that CEVA is offering a test chip based on SMIC's 90-nm process.
The first offerings in the TeakLite III family were the TL3210 and TL3214, which employ external DMA. The TL3211 with cache was due to become available in early 2008.
This first test chip produced by SMIC is for the 3210, including the TeakLite-III DSP core, memories, caches, AHB interfaces and emulation module.
TeakLite-III has a dual-MAC, 32-bit processing architecture enables the core to reach operating speeds higher than 700 MHz in 65-nm process. Intended applications include low-cost 2G/2.5G/3G wireless baseband modems, wideband voice and audio processors, portable media players, voice-over-IP residential gateways and high definition audio applications, supporting advanced audio standards such as Dolby Digital Plus 7.1, Dolby TrueHD and DTS-HD.
The first Teaklite-III chips produced on SMIC's 90-nm process exceeded 600-MHz in attainable clock frequency, Ceva said.
Related links and articles:
www.ceva-dsp.com
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