United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 

AMD researcher calls for design regularity
Print this article Email this article Reprints RSS Digital Edition

EE Times


SAN JOSE, Calif. — Overcoming manufacturability challenges at the 45-nanometer node and beyond requires a migration to more "regular" design layouts, according to Luigi Capodieci, principal memer of Advanced Micro Devices Inc.'s technical staff.

Presenting a paper at the SPIE Microlithography Conference here Tuesday (Feb. 22), Capodieci argued that irregular features within designs works against automated "layout printability verification" in an age where process variability has become prevalent.

More and more, Capodieci said, yield ramps can be accelerated by using regular, standardized circuits and features, a process he dubbed "design layout regularization." Incorporating only regular structures, Capodieci said, would enable a holistic view that would improve designs and printability.

Capodieci showed data from a recent analysis of a design that showed that three types of pitches were used most often and several others used much less frequently. Elimination of these irregular pitches, he argued, is necessary for improving manufacturability.

"Going towards 45 nanometer, our goal is to eliminate these other types of pitches that do not need to be there and can impact yield," Capodieci said. He called for regularity in device designs not only at the layout level, but at the circuit level as well.

Capodieci refuted the conventional notion that the strict use of regular circuits would cause a substantial penalty in area. He said several papers presented at last year's Design Automation Conference point to the viability of regular circuit fabrics — configurable bricks that are a fixed size and very easy to manufacture — without substantial area penalty.

According to Capodieci, chip makers are increasingly turning to two-dimensional, image-based design rule checks to identify potential yield-limiting factors. The goal for the industry at the 32-nm node, he said, is to try to make layout more one-dimensional, enabling the identification of irregular structures for systematic regularization of layout the level of place-and-route.

For the past 10 years, Capodieci joked, the constant evolution of resolution enhancement technology has remedied lack of intelligent designs. Lithographic-driven design-for-manufacturing (DFM) is now a well-established practice at the 65-nm node, he said. The continuing evolution of DFM depends on a drive toward more and more regular layouts, he said.






  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Looking for a new job?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
DoD Recognizes University Scientists For Basic Research
Annual awards to university faculty to conduct next-generation research projects were announced this week by the Defense Department.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.


All White Papers »   

  Design Resources
Designing for a dual Galileo-based GPS system
Malcolm Lomer of SiGe Semiconductor discusses GPS design challenges with the Galileo satellite system.
More »
 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2010 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About