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  Headlines for Wednesday Dec 2, 2009
Updated Tue, 01 Dec 2009 04:56:14 PM EST
Salary Survey: 'Hot' tech markets leave China EEs cold
The globalization of engineering has made some geography-specific trends more difficult to spot.
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Business
  • ISSCC preview: Non-volatile memory goes commercial
  • Inphi suit without merit, says Netlist
  • Samsung plans a $6 billion capex for 2010, says report
  • Alchimer eliminates seed step from TSV process
  • Philips borrows $300 million to spend on healthcare R&D
    Technology
  • ISSCC preview: Non-volatile memory goes commercial
    Products
  • ISSCC preview: Non-volatile memory goes commercial


      Headlines for Tuesday Dec 1, 2009
    Business
  • SEMI: No new fabs expected in 2010
  • Nokia sues LCD makers over price fixing
  • Aquantia, Xirrus obtain VC funding
  • ARM exec gives hints for IP business model optimization
  • Startup ready to license silicon anode for battery
  • Analyst: Taiwan foundries on allocation
  • Chip equipment market to grow 50% in 2010, says SEMI
  • Semefab to spend $11 million building a CMOS fab
  • Analyst raises forecast on soaring October chip sales
  • Samsung ramps production of 30-nm NAND memory
  • October chip sales grew fastest in Europe
  • Semiconductor analyst adds affiliate in India
  • Squeezable interface aims to grab 3-D content market
  • Plus Semi agrees to buy X-Fab's U.K. wafer fab
  • Giesecke & Devrient buys Nokia's share of NFC startup
  • D&R adds configurable documentation platform
  • Chinese processor firm licenses Dolphin's audio codecs
  • Infineon extends LED lighting IC portfolio
    Technology
  • Piezioelectric scheme seeks to reap the wind while driving
    Products
  • Single-chip TV receiver supports analog, digital
  • MindTree algorithm stitches video
  • Actel extends core8051s processor support


      Headlines for Monday Nov 30, 2009
    Business
  • Semicon Japan: Axcelis, KLA roll tools
  • Inphi sues Netlist for patent infringement
  • Update: Altera bumps up Q4 sales target
  • Firm to lease New York fabs, facilities
  • Broadcom to acquire Dune Networks for $178 million
  • Analysis: Sleeping giant Applied wakes up
  • Worst could be over for solar slump
  • Low-power FPGA startup hits volume production
  • Obducat's CEO resigns amid losses
  • Wintegra samples wireless network processor
  • Survey shows how users want more on mobiles
  • October's averaged chip sales beat expectations
  • Ceravision signs Toshiba for microwave lighting
  • Apple accused of NAND price manipulation, says Korean report
  • 2009 Salary Survey: Engineers take a bad year in stride
  • Chinese, Indian engineers expand wish list
  • What ails Japanese engineers?
  • Join the conversation. Why standards still matter
  • Engineers take a bad year in stride
  • Salary Survey: 'Hot' tech markets leave Chinese EEs cold
    Consumer
  • Smart grid hits snag over powerline standard
    Technology
  • IBM achieves accurate brain simulation
  • Osmotic power generators harvest energy from sea
  • Where next? Debating the future of manned space flight
  • 3-D radar data-capture innovation makes IEDs easier to spot
    Products
  • Spansion MirrorBit module available for Spartan-6
  • Samsung SGH-J750: Handling complexity and time-to-market one step at a time


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