Latest News
Headlines for Friday, May 25, 2012
Business
Renesas cuts 14,000 jobs; fab sale to TSMC
'Berthing' a commercial space industry
Former Conexant CEO tapped to lead Lantiq
Murata completes takeover of VTI with name change
Sharp to transfer LCD technology to Hon Hai’s China plant
ST's priorities: Sustain analog, expand into digital
SIA holds yearly council and drafts global chip tariff policy
Technology
Update: Dragon docked to space station
Headlines for Thursday, May 24, 2012
Technology
Intel to spend $40 million on international university research
High-G MEMS help detect concussions
IMU integrates accelerometer, gyro
Dragon cargo ship, space station fly in formation
SRC clears path to 14-nm with directed self-assembly
High Voltage CMOS process tackles power
ARM CTO looks at architecture scaling for 2020 solutions
Business
Renesas still struggling with restructuring plan
Reports: Renesas to tie up with TSMC, cut jobs
Slideshow: Sun shines on UMC's new fab
UMC breaks ground for $8-billion fab expansion
Product
Spansion sampling single-level cell NAND for embedded apps
Headlines for Wednesday, May 23, 2012
Business
Intersil to cut 11% of workforce
Synopsys names co-CEO to join de Geus
Dell's results seen as bad news for Intel
TCL to launch motion-controlled Android TV first in China
Report reveals fake chips in U.S. military hardware
Silicon Valley’s latest product—diamonds
HTC dials in to Taiwan’s 4G battle
Design
Teardown slideshow: The anatomy of the LED light bulb
TI rolls high data rate CAN transceivers
NI tips LabVIEW Electrical Power Suite for power monitoring
Technology
TI says copper wire bonding momentum growing
Memristor is 200 years old, say academics
Headlines for Tuesday, May 22, 2012
Technology
Video and audio storage requirements drive doubling of maximum hard drive densities by 2016
Next stop for SpaceX is space station
ST works with startup on 'permanent' in-ear audio
Indy electronics drive cars to be lighter, faster
Microsoft and Skolkovo Foundation cooperate on cloud
UK researchers follow silicon-oxide ReRAM route
Startup opens GaN-on-Si wafer production facility
Electronic components travel well on Space missions
Product
Agilent Technologies develops voice-over-LTE test system with Brüel & Kjær
MaxLinear tips front-end receivers for video gateways, STBs
Business
Jha out as Google closes Moto Mobility buy
Will Japan Inc. say sayonara to TV manufacturing?
Qualcomm offers $250,000 funding for best startup
China Mobile taps Mindspeed for femtocells
HDD densities expected to double by 2016
Headlines for Monday, May 21, 2012
Business
Handset shipments projected to rise 11% in 2012
SMSC investors sue to stop takeover by Microchip
Packaging materials firm snags $10.5M in funding
Foxconn to spend $210M on new Apple production plant
JEDEC publishes LPDDR3 standard for low-power memory devices
Report: Hynix, Globalfoundries in talks to buy Elpida
Silicon Labs to buy wireless mesh networking firm
Russia drives into U.S. fabless funding
ARM signs HiSilicon to use Mali GPU cores
Design
ON Semi expands Czech design center
Technology
Small basestations will be big
DO-178 software reuse in the ISO 26262 domain reduces cost for automotive suppliers
Inexact processor is more power efficient
IEEE group defines body area network
Extra!
Cadence CEO: EDA firms must innovate beyond software
Financial
Aquantia closes $35 million Series F funding round
Product
AMD plugs Trinity into embedded systems
Headlines for Sunday, May 20, 2012
Business
Facebook founder marries in secret ceremony
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