Latest News
Headlines for Tuesday, February 7, 2012
Product
Transphorm announces GaN products at 600-V
Technology
Researchers develop novel form of hafnium oxide
Business
Plessey buys Cambridge spin-off for HB LEDs
Headlines for Monday, February 6, 2012
Extra!
Questions Cloud Outlook at 'New' AMD 
Business
Veeco sees no near-term uptick in LED market
BlackBerry PlayBook sees further price cuts
Rambus buys memory startup for $35 million
Global chip sales squeeze 0.4% annual growth
Intel terahertz supplier secures $5.5 million funds
Technology
Product
Broadcom RFIC shrinks microwave backhaul nets
Career
Reports: trace carcinogens found in Korean wafer fabs
Headlines for Sunday, February 5, 2012
Technology
Big Switch releases open source controller for OpenFlow
Headlines for Saturday, February 4, 2012
Business
Appleton's death could delay DRAM consolidation
Headlines for Friday, February 3, 2012
Business
New IBM CEO sees her salary doubled
IBM SmartCamp startups attempt to solve world problems
Micron's Steve Appleton dies in plane crash
Panasonic predicts loss of $10 billion for fiscal year
Sonics, Tensilica team to improve IP efficiency
Microchip posts weak fiscal Q3, outlook brighter
Extra!
ARM Mulls Non-Volatile Memory IP acquisition
Product
STMicro extends appliance control offerings
Headlines for Thursday, February 2, 2012
Business
NXP gives sneak peek at new engineering workbench app
Video: HP's Prith Banerjee discusses HP labs, ARM servers and optical interconnects
AMD: New faces, new road maps, new focus
Elpida posts big loss, denies Micron deal
ASPs weigh as Hynix' losses reduced in Q4
CMOS timing startup raises $2.3 million
Infineon profits trimmed by lower sales
TSMC plans 3-D IC assembly launch early in 2013
Cadence a billion dollar company once again
U.S. probes Qualcomm's foreign business practices
Conferences & Shows
Rick Merritt DesignCon wrap up; 3D stacking, optical interconnects
Technology
HP rolls OpenFlow code for its switches
U.K. to spend $120 million on graphene institute
CNSE receives federal grants for nanotechnologies
Qualcomm, Ericsson demo LTE-to-3G handover
Headlines for Wednesday, February 1, 2012
Business
Panel probes T&M’s tech chiefs
Viewpoint: 'The R&D credit doesn't work'
How to solve $16.7 billion product returns problem
Time to play hard ball on tech manufacturing
Discipline key to engineering innovation, says Microsoft exec
Mali graphics to lead in smart TVs, says ARM's East
Technology
HP R&D chief shows road to terabyte backplane
CEA-Leti opens 3-D IC packaging service
Conferences & Shows
CEO of iFixit blasts Apple for tiny torx screws
New versions of Wi-Fi expected to boost tablets
Lines blurring between digital, analog design worlds
Product
Movidius teams with Toshiba on 3-D camera system
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