United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 

CEVA DSP's bright future
Print this article Email this article Reprints RSS Digital Edition

DSP DesignLine


Last week CEVA announced that NXP was adopting its CEVA-Teak DSP core for its ulta-low-cost cellular solutions. The move isn't too surprising. After StarCore shut down and LSI Logic sold its DSP operations to ASIC house Verisillicon, CEVA was left as the only pure-play DSP licensor—at least as far as "general-purpose" DSPs are concerned. There are still many companies licensing specialized DSP cores (3Plus1 is one good example), but these competitors are generally much smaller than CEVA. This is particularly true in the cellular baseband market, where CEVA has a 53% market share. These days, CEVA mainly competes with chip companies like TI that have their own in-house DSP architectures.

Recent events indicate that CEVA is gaining ground on these competitors. For example, leading handset maker Nokia no longer relies exclusively on TI for baseband chips. Instead, the company has partnerships with Broadcom and STMicroelectronics—both of whom are CEVA licensees. Similarly, number two handset maker Samsung is now using NXP's single-chip solution for its ultra-low-cost handsets—and NXP is also a CEVA licensee.

Behind these events lies an important trend: Phone manufacturers are looking to multi-source their baseband chips instead of relying on one vendor. Having multiple vendors gives them more design flexibility and more power to negotiate lower prices. This push for multi-sourcing gives CEVA an important advantage over its rivals: Since multiple vendors use CEVA cores, software written for CEVA cores can easily be ported to chips from multiple vendors. Code written for proprietary architectures such as TI's or Qualcomm's cannot be ported so easily, making it painful to switch vendors.

This is hardly a prediction of doom for vendors like TI and Qualcomm. For one thing, development of cutting-edge handsets still requires a close relationship between the handset vendor and the chip vendor—and only industry leaders like TI and Qualcomm have the resources it takes to make these projects a success. However, it doesn't make sense for handset makers to have exclusive relationships in the ultra-low-cost sector. In this market, CEVA appears to be gaining the advantage.






  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Looking for a new job?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
DoD Recognizes University Scientists For Basic Research
Annual awards to university faculty to conduct next-generation research projects were announced this week by the Defense Department.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2010 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About