RTI International and venture capital firm Intersouth Partners co-led the Series A round. The financing will be used to launch the company, expand the management team and continue product development.

The company's technology allows bare die integrated circuits to be densely populated on to a large area silicon substrate, replacing the current method of putting packaged die onto a conventional printed circuit board. The company says the platform allows a smaller overall system to deliver higher functionality and performance, with reduced power requirements due to fewer signal discontinuities and shorter traces between die.

"We believe that Beeco is positioned to make significant breakthroughs in computing capability" said Katrin Burt of Intersouth Partners. "The companys proprietary technology will result in smaller and simpler semiconductor structures with improved performance, solving significant industry problems."

RTI International President and CEO Victoria Haynes added: "We are optimistic that the work our scientists and engineers have invested in this technology will lead to significant advances in computing technology and innovative circuit board development."