OTTAWA — TechOnline analysts reveal a list of who's who inside iPhone 3G, getting under the phone's skin and peeking at the works.

As previously reported, those inside the new iPhone 3G include Samsung, Triquint Semiconductor, SST, Infineon and others.

While none of those chip vendors are allowed to announce their big design wins due to their non-disclosure agreement with Apple, the video below identifies the sources.

The video is divided in two parts: In Part 1, we look at the main board and see just how much TriQuint and Infineon won out on the new iPhone, as well as how Apple stuck with what worked on the original iPhone.

In Part 2, we show why we think Apple may be pulling away from prior deals with Samsung in favor of other memory suppliers, while also exposing who's supplying the Wi-Fi and Bluetooth capability for the new iPhone (hint: no surprises here).

PART 1

PART 2