"When selecting a DSP for our next-generation of cost-effective femtocell processors, the CEVA-TeakLite-III DSP emerged as the optimal solution, providing the ideal feature set and power/performance balance for our requirements," said Shlomo Gadot, CEO of Percello (Hertzliya, Israel).

Femtocells are poised to have a tremendous impact on the provision of wireless voice and data services in the next few years and Percello is ideally positioned to address this demand with their advanced wireless infrastructure processors, commented Gideon Wertheizer, CEO of CEVA.

"This latest selection of our DSP cores for femtocell applications is indicative of our continued expansion into new addressable markets beyond mobile handsets, added Wertzheimer.

Fabless chip group Percello was founded in 2007 specifically to target baseband ICs for 3G/HSDPA/HSUPA/HSPA+/LTE femtocells.

Its first device, codenamed PRC6000, will be the first in the company's Aquilo family. Initial chips are expected to be available for mass production in the first half of 2009.

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