SAN FRANCISCO—Memory technology licensor Rambus Inc. said Tuesday (May 26) that the U.S. District Court for the Northern District of California has ordered Hynix Semiconductor to secure about $397 million through a combination of a bond and a lien on a Hynix property in South Korea stemming from a March ruling in favor of Rambus.
On March 10, the court entered a judgment against Hynix, ordering the South Korean firm to pay Rambus $349 million for patent infringement plus another $48 million in pre-judgment interest.
According to Rambus, the court ordered Hynix to post the bonded amount of $250 million within 45 days.
In a statement, Thomas Lavelle, senior vice president and general counsel at Rambus, said Rambus believes Hynix should have been required to post a bond for the entire amount of the judgment.
"If Hynix's proposed lien fails to show value of roughly $300 million, we will ask the court for other security in order to protect Rambus' interests," Lavelle said.
The court also ordered Hynix to pay compulsory license fees into escrow pending the outcome of an appeal Hynix filed in the matter, Rambus (Los Altos, Calif.) said.
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