United Business Media EE Times


Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Corning IntelliSense, Northrop Grumman team on RF MEMS








Silicon Strategies


WILMINGTON, Massachusetts --- Corning Intellisense has said it is collaborating with Northrup Grumman Corp. on an Air Force Research Laboratory/ Defense Advanced Research Projects Agency sponsored 'RF MEMS Improvement Program'. The program is intended to focus on the design, modeling and fabrication of low-cost, highly reliable RF MEMS devices for Department of Defense (DoD) applications, Corning said.

The duration and financial terms of the program were not disclosed.

"It is a great opportunity for us to combine our expertise in MEMS with that of Northrop Grumman. We look forward to pushing the state of the art and assisting the advancement of ultra-reliable RF MEMS for both DoD and wireless communications," said Jonathan Bernstein, vice president of technology at Corning IntelliSense, in a statement.

RF MEMS leverage the mechanical and electrical attributes of MEMS (micro-electromechanical systems) technology to address shortcomings of traditional semiconductor devices. In the case of RF switches, if adequate reliability could be achieved, a micro-mechanical switch could provide greater isolation than solid-state switch. For many wireless applications, RF MEMS could offer smaller, lower power, and higher performing communication products, Corning said.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
Federal CTO Sees IT Leading U.S. Out Of Recession
Aneesh Chopra is looking to other CIOs to advise him on fleshing out a more detailed agenda to best serve the president's IT agenda.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

10 in trouble: EE Times has assembled a list of 10 companies (or more) that seem in particular danger of continuing to spill red ink, being acquired, seeking bankruptcy protection or just not being around in current form a year from now. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Our take on Intel-River: With its acquisition of embedded software leader Wind River Systems Inc., Intel Corp. has unambiguously signaled that it is again attempting to diversify beyond X86 processors. Here's our take on the deal. More...

Can wireless HD survive?: When Yoav Nissan-Cohen, chairman and CEO of Amimon, stopped by our offices here to discuss the state of the wireless video networking industry, he had three messages to deliver. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 8.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About