United Business Media EE Times


Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

AMD confirms Athlon XP 3200+ is same die as predecessor








Silicon Strategies


LONDON, England -- Advanced Micro Devices Inc. has confirmed that the latest version of its Athlon XP 32-bit microprocessor, the Athlon XP 3200+, is physically the same as its predecessor, the Athlon XP 3000+.

"Physically and electrically they are the same. It's the same die," said John Crank, senior brand associate with AMD.

The difference between the two processors, Crank said, is that the Athlon XP 3200+ is guaranteed to run with the so-called 400 front side bus, a bus connection that operates at up to a 200-MHz clock frequency and transfers data on rising and falling clock edges, whereas the Athlon XP 3000+ is only guaranteed to run with a 333 front side bus, which transfers data on the rising and falling edges of a clock frequency of up to 167-MHz.

Similarly the Athlon XP 3200+, which was introduced this week (see May 13 story), is guaranteed to operate at up to a 2.2-GHz main clock frequency whereas the Athlon XP 3000+ is only guaranteed to operate at up to a 2.167-MHz main clock frequency.

The die is made by AMD in a 0.13-micron manufacturing process technology.

The number suffix that AMD uses to denote processors is intended to indicate a performance level without being related strictly to clock frequency, a parameter which AMD argued could confuse computer purchasers.

Crank said that since the introduction of Athlon XP processors based on the Barton 32-bit microprocessor core, the die had remained the same for the Athlon XP 2800+, 3000+ and now the 3200+, and that the different processors are sorted into lots by testing on the wafer.

Crank said that Athlon processors capable of being classified as 3200+ devices had possibly existed from the introduction of the 2800+ in February but he said the phased introduction of different validated Athlon XP grades is necessary to fit in with partners' and customers' requirements.

"It's a business decision," Crank said.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
Federal CTO Sees IT Leading U.S. Out Of Recession
Aneesh Chopra is looking to other CIOs to advise him on fleshing out a more detailed agenda to best serve the president's IT agenda.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

FPGA startup crunch: These articles are part of a series that examines the status of various FPGA startups in light of the economic recession. Startups Abound Logic, Achronix Semiconductor and Cswitch are all on the hot seat. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Our take on Intel-River: With its acquisition of embedded software leader Wind River Systems Inc., Intel Corp. has unambiguously signaled that it is again attempting to diversify beyond X86 processors. Here's our take on the deal. More...

CEVA's reversal: When Gideon Wertheizer, CEVA's CEO, came to New York to ring the closing bell at Nasdaq to celebrate the company's 10th year anniversary, he talked about CEVA's 21.6 percent revenue growth in 2008. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 8.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About